The 2019 International Symposium on Advanced Power Packaging (ISAPP2019) will be held from October 7th & 8th, at Osaka University, Osaka, Japan. This international symposium aims to gather and evaluate all the aspects of science, technology, and business in the fields of the next generation packaging technology and passive components of power electronics especially for wide band gap semiconductors (WBGs) and to review their reliability issues on power electronics applications including electric mobilities such as cars, trains, airplanes, industrial/humanoid robots, IoT, and renewable energies/energy grids. This symposium will bring together key persons from all over the world and from every sector of academy and industry in the field of next generation power electronics.
Solders, sinter joining, TLP joining, wiring, ceramic/organic substrates, molding/potting compounds, coating, TIM
Process Technologies and Machines
Joining process and machine, wiring machine, molding machine, high-precision electronic printing, plating/coating, washing and surface treatment machine, drying/curing
Capacitors, resistors, soft-magnet and reactor
Characterization, Design and Simulation
Thermal measurement, thermal management, cooling system, electric measurements, reliability test (power cycling, thermal shock, etc), corrosion tests, spectroscopy, design, life-time modeling
ISAPP2019 holds following sessions: plenary and invited lectures, approximately 30 invited talks, and 100 contributed papers at the poster sessions.
Contributed paper submissions should describe original and unpublished work related to power electronics packaging,passive components, and their reliability. At the online submission via the conference homepage, which will be open soon, the authors are requested to choose one session where they prefer to give their presentations. Abstract is maximum 300 word long and extended abstract 4 pages maximum.