International Symposium on Advanced Power Packaging 2019

October 7 & 8, 2019 Suita Campus, Osaka University Osaka, Japan

Abstract deadline: May 21, 2019

ISAPP2019 office

Institute of Scientific and Industrial Research, Osaka University
8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
Email:office@isapp.jp

Map & Contact

Number 11 is the venue.