International Symposium on Advanced Power Packaging 2019

October 7 & 8, 2019 Suita Campus, Osaka University Osaka, Japan

Abstract deadline: May 21, 2019

Important Dates & Committees

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  • Abstract submission deadline    May 31, 2019
  • Notification of acceptance until    August 2, 2019
  • Deadline for early registration    August 16, 2019
  • Extended abstract submission deadline    September 5, 2019

 

Organizing Committee

Katsuaki Suganuma (Osaka University, Japan) General Chair
Tsuyoshi Funaki (Osaka University, Japan) Program Chair
Hiroshi Nishikawa (Osaka University, Japan) Program Co-chair
Miyuki Harada (Kansai University, Japan)
Kiyoshi Hirao (National Institute of Advanced Industrial Science and Technology, Japan)
Junichi Murai (MITSUBISHI ELECTRIC CORPORATION, Japan)
Takashi Nakamura (Osaka University, Japan)
Keiko Otsuka (Osaka Research Institute of Industrial Science and Technology, Japan)
Toshio Sato (Shinshu University, Japan)
Keiji Toda (TOYOTA MOTOR CORPORATION, Japan)
Kazuhiro Tsuruta (DENSO CORPORATION, Japan)
Tetsuzo Ueda (Panasonic Corporation, Japan)
Kimihiro Yamanaka (Chukyo University, Japan)
Hiroshi Yamaguchi (National Institute of Advanced Industrial Science and Technology, Japan)

Technical Committee

Katsuaki Suganuma (Osaka University, JP)
Hideharu Sugihara (Osaka University, JP)
Hiroshi Nishikawa (Osaka University, JP)
Kimihiro Yamanaka (Chukyo University, JP)
Kiyoshi Kanie (Tohoku University, JP)
Ichihito Narita (Osaka Kyoiku University, JP)
Takuya Kadoguchi (TOYOTA MOTOR CORPORATION, JP)
Kazuhiko Sugiura(DENSO CORPORATION, JP)
Goro Izuta (MITSUBISHI ELECTRIC CORPORATION, JP)
Tomoaki Hara (Siemens AG, JP)
Yukinori Oda (C.Uyemura & Co.,Ltd., JP)
Ichiro Ota (SHOWA DENKO K.K., JP)
Minoru Ueshima (Daicel Corporation., JP)
Yuichi Aoki (ESPEC CORP., JP)
Kazutaka Takeshita (Yamato Scientific co., ltd., JP)
Hikaru Nomura (Senju Metal Industry Co., Ltd., JP)
Shijo Nagao (Osaka University, JP)
Chuantong Chen (Osaka University, JP)
Toru Sugahara (Osaka University, JP)

International Advisory Board 

Alberto Castellazzi (University of Nottingham, UK)
Tao-Chih Chang (Industrial Technology Research Institute of Taiwan, Taiwan)
Thomas Harder (European Center for Power Electronics e.V., Germany)
Won Sik Hong (Korea Electronics Technology Institute, Korea)
Francesco Iannuzzo (Aalborg University, Denmark)
Nando Kaminski (University of Bremen, Germany)
Leo Lorenz (European Center for Power Electronics e.V., Germany)
Guo-Quan Lu (Virginia Tech, US)
Josef Lutz (Cheminitz University, Germany)
Yu-Feng Qiu (Global Energy Interconnection Research Institute, China)
Andreas Schletz (Fraunhofer IISB, Germany)
Douglas C Hopkins (North Carolina State University, US)

In cooperation with the help of

一般社団法人 電子情報技術産業協会
Japan Electronics and Information Technology Industries Association (JEITA)

一般社団法人 日本ファインセラミックス協会
Japan Fine Ceramics Association (JFCA)

一般社団法人 日本電子回路工業会
Japan Electronics Packaging and Circuits Association (JPCA)

一般社団法人 エレクトロニクス実装学会
The Japan Institute of Electronics packaging (JIEP)

一般社団法人 大阪大学産業科学研究協会
The Osaka University Research Association of Industry and Science