International Symposium on Advanced Power Packaging 2019

October 7 & 8, 2019 Suita Campus, Osaka University Osaka, Japan

Abstract deadline: May 21, 2019

Program

Download the latest program from here!

(Updated: October 2, 2019) 

 

Plenary speakers:

Dr. Akira Nishizawa, JAXA, JAXA’s research and technologies on electric aircraft

Dr. Keiji Toda, Toyota Motor, Progress of Vehicle Electrification and Adoption of Next-generation Power Semiconductors

Dr. Leo Lorenz, ECPE, ECPE WBG Roadmap - Lead Applications for SiC and GaN

Prof. Tsuyoshi Funaki, Osaka University, A study on parasitic inductance and thermal resistance of multi-layered ceramic power module substrate