International Symposium on Advanced Power Packaging 2019

October 7 & 8, 2019 Suita Campus, Osaka University Osaka, Japan

Abstract deadline: May 21, 2019

Extended Abstract Submission

Contributed paper submissions should describe original and unpublished work related to power electronics packaging, passive components, and their reliability. 

Abstract submission is closed.

If you are interested in the late submission, please contact us (office@isapp.jp).

 

Extended abstract submission deadline    September 5, 2019

Extended abstract should be within 3 pages.

 

Extended Abstract Template (MS Word)

 Please submit your extended abstract to : office@isapp.jp

 The subject of the mail should be : "ISAPP Extended Abstract Submission: Firstname_Lastname"